LATEST HEADLINES

• OKI Develops Tiling Crystal Film Bonding (CFB) Technology For Heterogeneous Integration Of Optical Semiconductors Onto 300 mm Silicon Wafers

  8/14/2025

  OKI has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology.

• Authorized Distributor Mouser Electronics Offers Wide Portfolio Of Products From Infineon Technologies AG

  8/12/2025

  Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is an authorized global distributor of solutions from Infineon Technologies AG, a global semiconductor leader in power systems and IoT.

• Precision Timing To Power The Future Montage Technology Unveils High-Performance Clock Chip Portfolio

  8/8/2025

  Montage Technology today announced customer sampling of its clock buffer and spread-spectrum oscillator products, following the successful mass production of its clock generator chips.

• KYOCERA AVX Introduces New Hermaphroditic WTW & WTB Connectors

  8/7/2025

  KYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released the new 9288-000 Series hermaphroditic wire-to-wire (WTW) and wire-to-board (WTB) connectors for lighting and industrial applications.

• TDK Introduces Compact Double-Sided Metallized Polypropylene Film Capacitors For Resonant Topologies

  8/5/2025

  TDK Corporation presents its new EPCOS B3264xH series of double-sided metallized polypropylene film capacitors (MMKP).