LATEST HEADLINES

• Renesas Debuts New Group In Popular RA0 Series With Best-In-Class Power Consumption And Extended Temperature Range

  4/22/2025

  Renesas Electronics Corporation a premier supplier of advanced semiconductor solutions, today introduced the RA0E2 microcontroller (MCU) Group based on the Arm Cortex-M23 processor.

• Microchip Launches High-Reliability BR235 And BR235D Series Of Power Relays For Demanding Military Applications

  4/15/2025

  As a leading supplier to the aerospace and defense market, Microchip is committed to providing innovative and robust products that are designed for mission-critical performance in the most demanding environments.

• Navitas Announces Automotive Qualification Of High-Power GaNSafe™ ICs

  4/15/2025

  Navitas Semiconductor (Nasdaq: NVTS), the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride (GaN) power ICs and silicon carbide (SiC) technology, has announced its high-power GaNSafe^™ ICs achieve automotive qualification for both AEC-Q100 and AEC-Q101, showcasing GaN’s next inflection into the automotive market.

• Multilayer Ceramic Capacitors: TDK Offers MLCCs With The Industry's Highest Capacitance At 100V For Automotive Applications In 3225 Case Size

  4/14/2025

  TDK Corporation has expanded its CGA series for automotive multilayer ceramic capacitors (MLCCs) to 10 µF at 100 V in 3225 size (3.2 x 2.5 x 2.5 mm – L x W x H), with X7R characteristics (Class Ⅱ dielectric).

• Adaptive Additive Manufacturing And Volumetric 3D Printing Combined In New APES And Manifest Technologies Partnership

  4/8/2025

  Advanced Printed Electronic Solutions (APES) and Manifest Technologies have announced at the RAPID+TCT event in Detroit, Mich., a strategic partnership to integrate volumetric additive manufacturing (AM) into the new Matrix6D high-throughput adaptive AM platform from APES—unlocking a new era of high-speed, support-free 3D printing within a scalable, reconfigurable factory architecture.